Antenna system for transmitting and receiving mm-wave signal

ABSTRACT

Disclosed in an electronic device, which includes a housing that includes a first plate and a second plate facing a direction opposite the first plate, a conductive plate that is disposed in a first plane between the first plate and the second plate, and is parallel to the second plate, a wireless communication circuit that is disposed within the housing and is configured to transmit and/or receive a signal having a frequency ranging from 20 GHz to 100 GHz, a first electrical path having a first end electrically connected with the wireless communication circuit and a second end floated, the first electrical path including a first portion between the first end and the second end, a second electrical path having a third end electrically connected with the conductive plate and a fourth end floated, the second electrical path including a second portion between the third end and the fourth end.

CROSS-REFERENCE TO RELATED APPLICATION

This application is based on and claims priority under 35 U.S.C. § 119to Korean Patent Application No. 10-2017-0159884, filed on Nov. 28,2017, in the Korean Intellectual Property Office, the disclosure ofwhich is incorporated by reference herein its entirety.

BACKGROUND 1. Field

The present disclosure relates to a technology associated with acommunication device for transmitting/receiving a millimeter wavesignal.

2. Description of Related Art

In an electronic device transmitting data using wireless communication,a signal in a high frequency band of 20 GHz or higher may be used totransmit or receive a large amount of data such as a high-definitionimage, a high-quality sound, a high-definition video, or the like.

The electronic device may use a component formed of a conductivematerial as an antenna radiator for the purpose of transmitting orreceiving a signal in a low frequency band, but may use an antennamodule separately configured to transmit or receive a signal in a highfrequency band. The antenna module may be implemented in such a way thata radio frequency integrated circuit (RFIC) for transmitting/receiving asignal is mounted on a printed circuit board (PCB).

The above information is presented as background information only toassist with an understanding of the present disclosure. No determinationhas been made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the present disclosure.

In the case where an antenna array for transmitting or receiving asignal in a specified frequency band is implemented with an antenna PCBincluding a plurality of layers, it may be difficult to place acomponent for controlling a transmit or receive signal at the antennaPCB. As such, a separate component for controlling the transmit signalor the receive signal may be positioned at a main PCB 130 (refer to FIG.1), thereby causing an inefficient use of a limited space of the mainPCB 130.

SUMMARY

The present disclosure addresses at least the above-mentioned problemsand/or disadvantages and provides at least the advantages describedbelow. Accordingly, an aspect of the present disclosure is to provide anelectronic device which filters a signal in a specified frequency bandusing a feed line and a conductive line in an antenna PCB or changes asignal in a frequency band to be transmitted or received.

In accordance with an aspect of the present disclosure, an electronicdevice may include a housing that includes a first plate and a secondplate facing a direction opposite the first plate, a conductive platepositioned in a first plane between the first plate and the secondplate, and parallel to the second plate, a wireless communicationcircuit disposed within the housing and configured to transmit and/orreceive a signal having a frequency ranging from 20 GHz to 100 GHz, afirst electrical path having a first end electrically connected with thewireless communication circuit and a second end floated, the firstelectrical path including a first portion between the first end and thesecond end, a second electrical path having a third end electricallyconnected with the conductive plate and a fourth end floated, the secondelectrical path including a second portion between the third end and thefourth end. The first portion and the second portion may extend inparallel with each other and may provide electrical coupling between thefirst portion and the second portion.

In accordance with another aspect of the present disclosure, amillimeter wave communication device may include an antenna printedcircuit board (PCB) including a plurality of layers, an integratedcircuit (IC) disposed under the antenna PCB, a first feed lineelectrically connected with the IC and extending to a first layerthrough one or more of the plurality of layers of the antenna PCB, afirst portion of the first feed line disposed in the first layer andhaving a first length, a second feed line spaced from the first portionof the first feed line and disposed in a second layer of the antennaPCB, the second layer being an upper layer of the first layer, so as tobe electrically coupled with the first portion of the first feed line,and a first antenna element electrically connected with the second feedline in a third layer of the antenna PCB, the third layer being an upperlayer of the second layer. The IC may transmit and/or receive amillimeter wave (mm-wave) signal using the first feed line, the secondfeed line, and the first antenna element.

In accordance with another aspect of the present disclosure, amillimeter wave communication device may include an antenna printedcircuit board (PCB) including a plurality of layers, an integratedcircuit (IC) disposed under the antenna PCB, and a first feed lineelectrically connected with the IC and extending to a first layerthrough one or more of the plurality of layers of the antenna PCB, afirst portion of the first feed line being disposed in the first layerand having a first length, a second feed line that is disposed to becoupled with the first portion, and is disposed in the first layer ofthe first feed line in the first layer, and an antenna elementelectrically connected with the second feed line in a second layer ofthe antenna PCB, the second layer being an upper layer of the firstlayer. The IC may transmit and/or receive a millimeter wave (mm-wave)signal using the first feed line, the second feed line, and the antennaelement.

According to embodiments of the present disclosure, a communicationdevice for transmitting/receiving a millimeter wave signal mayefficiently use a space of a printed circuit board (PCB) without aseparate component(s) for controlling a transmit and/or receive signal,by making feed lines positioned in layers of the PCB coupled to eachother such that a power is supplied to an antenna element through feedand conductive lines, and by filtering the transmit and/or receivesignal.

Also, as an open stub may be formed at a conductive line connected to anantenna element or a variable capacitor is installed at the conductiveline, the communication device may easily control a transmit signal or areceive signal.

Other aspects, advantages, and salient features of the disclosure willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses various embodiments of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the present disclosure will be more apparent from thefollowing description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is an exploded perspective view illustrating components of anelectronic device according to various embodiments;

FIG. 2 is a sectional view illustrating a communication device accordingto an embodiment;

FIGS. 3A and 3B are perspective views illustrating a millimeter wavecommunication device including a plurality of antenna elements accordingto an embodiment;

FIGS. 4 and 5 are graphs illustrating a filtering characteristic of amillimeter wave communication device according to an embodiment;

FIG. 6 is a diagram illustrating an open stub formed at a conductiveline of a millimeter wave communication device according to anembodiment;

FIG. 7 is a graph illustrating a filtering characteristic in the casewhere an open stub is formed at a conductive line of a millimeter wavecommunication device according to an embodiment;

FIGS. 8A and 8B are diagrams illustrating a first feed line and a secondfeed line of a millimeter wave communication coupled through sidesformed with a specified width according to an embodiment;

FIGS. 9A and 9B are diagrams illustrating an example where a portion ofa first feed line and a second feed line of a millimeter wavecommunication device are positioned in the same layer according to anembodiment;

FIG. 10 is a sectional view illustrating how to adjust a couplinglocation of a millimeter wave communication device according to anembodiment;

FIG. 11 is a graph illustrating a filtering characteristic uponadjusting a coupling location of a millimeter wave communication deviceaccording to an embodiment;

FIG. 12 is a diagram illustrating components of a millimeter wavecommunication device for respective functions, according to anembodiment;

FIG. 13 is a diagram illustrating an example where a variable capacitoris installed at a millimeter wave communication device according to anembodiment;

FIG. 14 is a graph illustrating a filtering characteristic of amillimeter wave communication device where a variable capacitor isinstalled, according to an embodiment; and

FIG. 15 illustrates a block diagram of an electronic device in a networkenvironment according to various embodiments.

DETAILED DESCRIPTION

Hereinafter, various example embodiments of the present disclosure willbe described with reference to accompanying drawings. However, those ofordinary skill in the art will recognize that various modifications,equivalents, and/or alternatives of the various example embodimentsdescribed herein may be variously made without departing from the scopeand spirit of the present disclosure.

FIG. 1 is an exploded perspective view illustrating components of anelectronic device according to various embodiments.

Referring to FIG. 1, an electronic device 100 may include a rear cover111 (e.g., a second plate), a cover glass 113 (e.g., a first plate), adisplay 120, a main printed circuit board (PCB) 130, a communicationdevice (e.g., including communication circuitry) 140, and a battery 150.

According to an embodiment, the rear cover 111 may form the exterior ofthe electronic device 100. According to an embodiment, the rear cover111 may, for example, be formed of tempered glass, plastic, and/or metaland may protect various parts (e.g., the display 120 and the main PCB130) mounted within the electronic device 100 from external impact.According to an embodiment, the rear cover 111 may be integrallyimplemented with the cover glass 113 or may be implemented to beremovable.

According to an embodiment, the cover glass 113 may transmit a lightgenerated by the display 120. According to an embodiment, a user maytouch a portion (e.g., a finger) of his/her body on the cover glass 113to perform a touch input (including a contact using an electronic pen).According to an embodiment, the cover glass 113 may be formed oftempered glass, reinforced plastic, a flexible polymer material, or thelike.

According to an embodiment, the rear cover 111 and the cover glass 113facing away from (e.g., a direction opposite) the rear cover 111 mayform a housing of the electronic device 100. Components (e.g., thedisplay 120, the main PCB 130, the communication device 140, and thebattery 150) included in the electronic device 100 may be positionedwithin the housing and may be protected from external impact.

According to an embodiment, the display 120 may be interposed betweenthe cover glass 113 and the main PCB 130. According to an embodiment,the display 120 may be electrically connected with the main PCB 130 tooutput content (e.g., a text, an image, a video image, or the like).According to an embodiment, the display 120 may include a touch panel,and may receive a touch input (e.g., a touch, a gesture, a hovering, orthe like) from the user through the touch panel.

According to an embodiment, various electronic parts, various elements,various integrated circuits, or the like of the electronic device 100may be mounted on the main PCB 130. For example, an applicationprocessor (AP), a communication processor (CP), a memory, or the likemay be mounted on the main PCB 130. According to an embodiment, the mainPCB 130 may transmit/receive a specified signal through thecommunication device 140. According to an embodiment, the main PCB 130may display an image included in the received signal through the display120.

According to an embodiment, the communication device 140 may includevarious communication circuitry and communicate with an external device.For example, the communication device 140 may transmit data to anelectronic device of any other user, may receive data from an electronicdevice of any other user, or the like. According to an embodiment, thecommunication device 140 may be connected with the main PCB 130 and maytransmit/receive a signal in a specified frequency band. For example,and without limitation, the communication device 140 may transmit and/orreceive a signal in a millimeter frequency band of 26 GHz, 28 GHz, 39GHz, 60 GHz, or the like.

According to an embodiment, the communication device 140 may include anantenna printed circuit board (PCB). For example, the communicationdevice 140 may include an antenna PCB which includes a communication ICfor transmitting/receiving a signal, an antenna element, and/or a feedline electrically connecting the communication IC and the antennaelement. For example, the antenna PCB may include one layer or mayinclude of a plurality of layers. In the case where the antenna PCBincludes a plurality of layers, at least a portion of the feed line maybe formed between the plurality of layers. According to an embodiment,the communication device 140 may include a plurality of antenna elementsfor transmitting and/or receiving a specified signal. For example, thecommunication device 140 may include one antenna array including aplurality of antenna elements. According to an embodiment, thecommunication device 140 may transmit and/or receive a signal in aspecified direction. For example, the communication device 140 maytransmit/receive a signal toward the rear cover 111 (or in a zdirection). For example, the communication device 140 may transmitand/or receive a signal for 5th generation (5G) communication (e.g., asignal in a frequency band ranging from 26 GHz to 28 GHz, ranging from39 GHz to 40 GHz, a signal in a frequency band of 60 GHz, or the like).

According to an embodiment, the communication device 140 may beinterposed between the rear cover 111 and the cover glass 113. Forexample, the communication device 140 may be positioned at a cornerportion of the rear cover 111. For example, a plurality of communicationdevices 140 (e.g., four communication devices 140) may be positioned atrespective corners. Each of the plurality of communication devices 140may include, for example, an antenna array including a plurality ofantenna elements.

According to an embodiment, the battery 150 may be interposed betweenthe rear cover 111 and the display 120. According to an embodiment, thebattery 150 may supply electrical energy to the display 120 and the mainPCB 130. For example, the battery 150 may convert chemical energy toelectrical energy and may supply the converted electrical energy to thedisplay 120 and the main PCB 130. According to an embodiment, thebattery 150 may convert and store electrical energy supplied from theoutside to chemical energy. For example, the battery 150 may be asecondary cell which may be rechargeable.

A millimeter wave communication device according to various exampleembodiments of the present disclosure may filter a signal in a specifiedfrequency band using a feed line and a conductive line in a PCB or maychange a signal in a frequency band to be transmitted or received.

In the present disclosure, the description given with reference to FIG.1 may be applied to components having the same reference numerals/marksas the components of the electronic device 100 described with referenceto FIG. 1.

FIG. 2 is a sectional view illustrating a communication device accordingto an embodiment.

Referring to FIG. 2, the electronic device 100 may include thecommunication device 140 for receiving a signal in a specified frequencyband. The communication device 140 may include an antenna array.

According to an embodiment, the communication device 140 may include anantenna PCB 141, a communication IC 142, a radio frequency (RF)interface 143, a first feed line 144, a second feed line 145, an antennaelement 146 (e.g., an antenna patch), and a parasitic antenna element147 (e.g., a parasitic antenna patch).

According to an embodiment, the antenna PCB 141 may include a pluralityof layers M0 to M10. Components included in the communication device 140may be positioned in the plurality of layers M0 to M10. According to anembodiment, the antenna PCB 141 may be electrically connected with themain PCB 130. For example, the antenna PCB 141 may be electricallyconnected with the main PCB 130 through a ball grid array (BGA) 141 a.For another example, the antenna PCB 141 may be electrically connectedwith the main PCB 130 through a board to board (BtoB) connector.

According to an embodiment, the communication IC 142 may be positionedon a first surface of the antenna PCB 141, which faces the main PCB 130.For example, the communication IC 142 may be positioned on the firstsurface of the antenna PCB 141 using a solder ball 142 a. For anotherexample, the communication IC 142 may be positioned on the first surfaceof the antenna PCB 140 through flip chip bonding or wire bonding.According to an embodiment, the communication IC 142 may be interposedbetween the antenna PCB 141 and the main PCB 130.

According to an embodiment, the communication IC 142 may transmit and/orreceive a signal in a specified frequency band. For example, thecommunication IC 142 may transmit and/or receive a signal in a frequencyband ranging from 20 GHz to 100 GHz.

According to an embodiment, the communication IC 142 may be suppliedwith a power from the main PCB 130. For example, the communication IC142 may be supplied with the power for operation from the main PCB 130through the BGA 141 a, the solder ball 142 a, and a power line PWR. Forexample, the power line PWR may be formed in the second layer M1 of theantenna PCB 141. According to an embodiment, the communication IC 142may supply the communication device 140 with a current for transmittingand/or receiving a signal in a specified frequency band using thesupplied power.

According to an embodiment, the RF interface 143 may be formed in thefirst layer M0 of the antenna PCB 141. According to an embodiment, thecommunication IC 142 may be coupled with the RF interface 143. Thecommunication IC 142 may supply a current to the communication device140 through the RF interface 143.

According to an embodiment, the first feed line 144 may be electricallyconnected with the communication IC 142. For example, the first feedline 144 may be electrically connected with the communication IC 142through the RF interface 143. According to an embodiment, the first feedline 144 may extend to a specified layer through one or more of thelayers of the antenna PCB 141, and a first portion 144 a of the firstfeed line 144 may be positioned in the specified layer and have a firstlength. For example, the first feed line 144 may be extended to thefifth layer M4 through the first layer M0 to the fourth layer M3, andthe first portion 144 a of the first feed line 144 may be formed in thefifth layer M4 with the first length.

According to an embodiment, the second feed line 145 may be positionedin an upper layer with respect to the layer, in which the first portion144 a of the first feed line 144 is positioned, of the antenna PCB 141,and be coupled with the first portion 144 a of the first feed line 144.For example, a second portion 145 a of the second feed line 145 may bepositioned in the sixth layer M5 with a second length and be coupledwith the first portion 144 a of the first feed line 144. The secondlength may be identical to the first length of the first portion 144 aof the first feed line 144 positioned in the fifth layer M4. The secondfeed line 145 may be positioned to be physically spaced from the firstfeed line 144. According to an embodiment, when the first portion 144 aof the first feed line 144 and the second portion 145 a of the secondfeed line 145 are coupled, the current supplied from the communicationIC 142 may be transferred to the antenna element 146. For anotherexample, the first portion 144 a of the first feed line 144 and thesecond portion 145 a of the second feed line 145 thus coupled may filtera transmit signal or a receive signal in a specified frequency band.

According to an embodiment, the second feed line 145 may be electricallyconnected with the antenna element 146. For example, the second feedline 145 may be electrically connected with the antenna element 146through one or more layers (e.g., M5 to M7). As such, the second feedline 145 may transmit a signal output from the communication IC 142 ormay transmit a signal received through the antenna element 146.

According to an embodiment, the antenna element 146 may be positioned onan upper layer of the antenna PCB 141 with respect to the layer in whichthe second feed line 145 is positioned. For example, the antenna element146 may be positioned in the ninth layer M8. According to an embodiment,the antenna element 146 may include an electrical path for transmittingand/or receiving a signal in a specified frequency band. The antennaelement 146 may form an electrical path by a current supplied from thecommunication IC 142 to the second feed line 145 through the electricalpath.

According to an embodiment, the parasitic antenna element 147 may bepositioned in a layer above the layer in which the antenna element 146is positioned. According to an embodiment, the parasitic antenna element147 may form a directivity of a signal which is transmitted and/orreceived through the electrical path formed in the antenna element 146.For example, the parasitic antenna element 147 may form an electricfield by the electrical path in the positioned direction. According toanother embodiment, in the case where the parasitic antenna element 147is not included in the communication device 140, the antenna element 146may be positioned in the uppermost layer.

According to an embodiment, the antenna PCB 141 may include one or moreground layers. For example, a ground GND may be formed in one or morelayers among the layers included in the antenna PCB 141. For example,the ground GND may be formed in each of the third layer M2, the seventhlayer M6, and the ninth layer M8 of the antenna PCB 141. According to anembodiment, the plurality of grounds GND formed in the antenna PCB 141may be electrically connected to each other through a via(s) 148. Thevia 148 may be formed to penetrate one or more of the layers of theantenna PCB 141, for example. According to an embodiment, the via 148formed to penetrate the one or more layers may block interference of asignal which is transmitted and/or received through any other antennaincluded in the communication device 140.

According to an embodiment, the communication IC 142 of thecommunication device 140 may transmit and/or receive a millimeter wave(mm-wave) signal in a specified frequency band through the first feedline 144, the second feed line 145, and the antenna element 146.

According to another embodiment, a first end of a first electrical pathformed by the first feed line 144 positioned in the antenna PCB 141 maybe electrically connected with the communication IC 142, and a secondend thereof may be floated. The first electrical path may include thefirst portion 144 a between the first end and the second end. The firstelectrical path may include a third portion 144 b which penetrates apart of a plurality of layers of the antenna PCB 141 and electricallyconnects the communication IC 142 and the first portion 144 a. The thirdportion 144 b may be implemented with, for example, a first conductivevia formed to penetrate a part of the plurality of layers. The firstconductive via may electrically connect the communication IC 142 and thefirst portion 144 a.

According to another embodiment, a first end of a second electrical pathformed by the second feed line 145 positioned in the antenna PCB 141 maybe electrically connected with the antenna element 146, and a second endthereof may be floated. The second electrical path may include thesecond portion 145 a between the first end and the second end. Thesecond electrical path may include a fourth portion 145 b whichpenetrates a part of the plurality of layers of the antenna PCB 141 andelectrically connects the antenna element 146 and the second portion 145a. The fourth portion 145 b may be implemented with, for example, asecond conductive via formed to penetrate a part of the plurality oflayers. The second conductive via may electrically connect the antennaelement 146 and the second portion 145 a.

According to an embodiment, the first portion 144 a and the secondportion 145 a may extend in parallel with each other, and may provideelectrical coupling between the first portion 144 a and the secondportion 145 a. For example, the first portion 144 a and the secondportion 145 a thus coupled may filter a portion of a signal which istransmitted and/or received through the antenna element 146.

According to an embodiment, the antenna element 146 (or a conductiveplate) may be positioned in a first plane between the rear cover 111 (ora second plate) and the cover glass 113 (or a first plate), and may beparallel to the rear cover 111. According to an embodiment, thecommunication IC 142 may be parallel to the rear cover 111 and may bepositioned in a second plane between the first plane and the cover glass113. According to an embodiment, the antenna PCB 141 may include a firstsurface (e.g., the first layer M0) facing the cover glass 113, a secondsurface (e.g., the eleventh layer M10) facing the rear cover 111, and aplurality of insulating layers between the first surface and the secondsurface.

According to an embodiment, the communication IC 142 may be mounted onthe first surface.

According to an embodiment, the plurality of layers may include, forexample, a first layer (e.g., the sixth layer M5), a second layer (e.g.,one of the second to fifth layers M1 to M4) between the first layer andthe first surface, and a third layer (e.g., one of the seventh to tenthlayers M6 to M9) between the first layer and the second surface.According to an embodiment, the first portion 144 a of the first feedline 144 may be inserted between the first layer and the second layer(e.g., in the fifth layer M4), and the second portion 145 a of thesecond feed line 145 may be inserted between the first layer and thethird layer (e.g., in the sixth layer M5). According to an embodiment,the antenna element 146 may be inserted between the third layer and thesecond surface (e.g., in the ninth layer M8).

FIGS. 3A and 3B are perspective views illustrating a millimeter wavecommunication device including a plurality of antenna elements accordingto an embodiment.

Referring to FIG. 3A, the communication device 140 may include aplurality of antenna elements. For example, the communication device 140may include a plurality of ports which may transfer a signal output fromthe communication IC 142 or a signal received through the plurality ofantenna elements.

According to an embodiment, the communication device 140 may include afirst antenna element 146-1, a second antenna element 146-2, a thirdantenna element 146-3, and a fourth antenna element 146-4. The first tofourth antenna elements 146-1 to 146-4 may be identical or similar tothe antenna element 146 of FIG. 2.

According to an embodiment, the first to fourth antenna elements 146-1to 146-4 of the communication device 140 may be positioned in the samelayer. According to an embodiment, the first to fourth antenna elements146-1 to 146-4 may be positioned with respect to the communication IC142. According to an embodiment, the first to fourth antenna elements146-1 to 146-4 may be positioned to be physically separated from eachother. For example, the first to fourth antenna elements 146-1 to 146-4may be positioned to be separated from each other by a specifiedinterval (or distance) with respect to the communication IC 142.

According to an embodiment, the communication device 140 may include theantenna PCB 141 and the communication IC 142. According to anembodiment, the communication device 140 may include a first port P1, asecond port P2, a third port P3, and a fourth port P4, which are used totransfer a signal output from the communication IC 142 and/or a signalreceived through the first to fourth antenna elements 146-1 to 146-4.For example, the communication device 140 may include the first tofourth ports P1 to P4 each including a first feed line and a second feedline. For example, the communication device 140 may include four firstfeed lines 144-1, 144-2, 144-3, and 144-4 and four second feed lines145-1, 145-2, 145-3, and 145-4. To transmit a signal output from thecommunication IC 142 and/or a signal received through the first tofourth antenna elements 146-1 to 146-4, the four first feed lines 144-1,144-2, 144-3, and 144-4 may be positioned to be similar to the firstfeed line 144 of FIG. 2, and the four second feed lines 145-1, 145-2,145-3, and 145-4 may be positioned to be similar to the second feed line145 of FIG. 2. As such, a portion (or a signal filtering portion) wherethe first feed line 144-1, 144-2, 144-3, or 144-4 and the second feedline 145-1, 145-2, 145-3, or 145-4 are coupled may be formed at the portP1, P2, P3, or P4 of the communication device 140. The communicationdevice 140 may transmit/receive a signal in a specified frequency bandthrough the first to fourth antenna elements 146-1 to 146-4 using thefirst feed lines 144-1, 144-2, 144-3, and 144-4 and the second feedlines 145-1, 145-2, 145-3, and 145-4.

According to another embodiment, at least one of a plurality of portsrespectively connected with a plurality of antenna elements of thecommunication device 140 may not be electrically connected with anantenna element. For example, a second feed line of the communicationdevice 140 may not be connected with an antenna element, and thus, aport may not be connected with the antenna element. The port which isnot connected with the antenna element may be maintained, for example,at an open state. For another example, the port which is not connectedwith the antenna element may be connected to a ground. As such, afrequency band of a signal which the communication device 140 transmitsand/or receives may be changed.

Below, the communication IC 142 will be described with reference to thefirst feed line 144-1 and the second feed line 145-1 connected to thefirst antenna element 146-1. A description which will be given withreference to the first antenna element 146-1 may be identically orsimilarly applied to the second antenna element 146-2, the third antennaelement 146-3, and the fourth antenna element 146-4.

Referring to FIG. 3B, the first feed line 144-1 and the second feed line145-1 may be coupled.

According to an embodiment, the first feed line 144-1 may beelectrically connected to the communication IC 142. The second feed line145-1 may be electrically connected to the first antenna element 146-1.

According to an embodiment, a first portion 144-1 a of the first feedline 144-1 may be positioned in a first layer (e.g., the fifth layer M4)of the antenna PCB 141. According to an embodiment, a second portion145-1 a of the second feed line 145-1 may be positioned in a secondlayer (e.g., the sixth layer M5) being an upper layer of the firstlayer. According to an embodiment, the first portion 144-1 a of thefirst feed line 144-1 and the second portion 145-1 a of the second feedline 145-1 may be positioned parallel to each other. For example, thefirst portion 144-1 a of the first feed line 144-1 and the secondportion 145-1 a of the second feed line 145-1 may at least partiallyoverlap each other when viewed from above the antenna PCB 141. As such,the first portion 144-1 a of the first feed line 144-1 and the secondportion 145-1 a of the second feed line 145-1 may be coupled.

According to an embodiment, a power supplied from the communication IC142 may be transmitted to the first antenna element 146-1 through thefirst feed line 144-1 and the second feed line 145-1 physicallyseparated from the first feed line 144-1. According to an embodiment,the coupled portions of the first feed line 144-1 and the second feedline 145-1, that is, the first portion 144-1 a and the second portion145-1 a may filter a signal in a specified frequency band. For example,the first portion 144-1 a and the second portion 145-1 a thus coupledmay filter at least a portion of a signal which is transmitted and/orreceived through the first antenna element 146-1. According to anembodiment, a frequency band to be filtered may be determined accordingto a length of the first portion 144-1 a and the second portion 145-1 athus coupled.

FIGS. 4 and 5 are graphs illustrating a filtering characteristic of amillimeter wave communication device according to an embodiment.

Referring to FIGS. 4 and 5, in the communication device 140, at leastone of a plurality of ports connected to a plurality of antenna elementsmay not be connected with an antenna element.

Referring to FIG. 4, the at least one port which is not connected at thecommunication device 140 may be connected to a ground.

According to an embodiment, the communication device 140 may have afiltering characteristic “A” in which a signal in a frequency bandranging from 23.4 GHz to 24 GHz with regard to the 20 GHz band for 5Gcommunication is rejected. For example, the first feed line 144-1 andthe second feed line 145-1 thus coupled may have the filteringcharacteristic “A” in which a signal in a frequency band ranging from23.4 GHz to 24 GHz is rejected. According to an embodiment, thecommunication device 140 may have a filtering characteristic “B” inwhich a signal in a sub-6 band is rejected.

Referring to FIG. 5, the at least one port which is not connected at thecommunication device 140 may be maintained at an open state.

According to an embodiment, the communication device 140 may have afiltering characteristic A′ in which a signal in a frequency bandranging from 21.9 GHz to 24.5 GHz with regard to the 20 GHz band for 5Gcommunication is rejected. For example, the first feed line 144-1 andthe second feed line 145-1 thus coupled may have the filteringcharacteristic A′ in which a signal in a frequency band ranging from21.9 GHz to 24.5 GHz is rejected. According to an embodiment, thecommunication device 140 may have a filtering characteristic B′ in whicha signal in the sub-6 band is passed.

According to an embodiment, the communication device 140 may change afrequency band for transmission or reception by changing a state of atleast one unused port (or a port not connected with an antenna element).

FIG. 6 is a diagram illustrating an open stub formed at a conductiveline of a millimeter wave communication device according to anembodiment.

Referring to FIG. 6, an open stub may be formed at a specified locationof the first feed line 144-1 of the communication device 140 or at aspecified location of the second feed line 145-1 of the communicationdevice 140. For example, the open stub may be formed at one end of thefirst feed line 144-1 connected with the communication IC 142. Foranother example, the open stub may be formed at one end of the secondfeed line 145-1 connected with the first antenna element 146-1.

According to an embodiment, in the case where the open stub 149 isformed at one end of the first feed line 144-1 or the second feed line145-1 of the communication device 140, a characteristic of a signalwhich is transmitted and/or received through the first feed line 144-1and the second feed line 145-1 thus coupled may be changed. According toan embodiment, in the case where the open stub 149 is formed at one endof the first feed line 144-1 or the second feed line 145-1 of thecommunication device 140, a length of the first feed line 144-1 and thesecond feed line 145-1 necessary to transmit and/or receive a signal ina similar frequency band may be reduced. For example, to reduce a lengthof a first portion (e.g., the first portion 144-1 a) or a second portion(e.g., the second portion 145-1 a), the first feed line 144-1 or thesecond feed line 145-1 must be positioned in a specified layer for thecoupling between the first feed line 144-1 and the second feed line145-1. The reduced length may be, for example, greater than a length ofthe open stub 149 formed at the second feed line 145-1.

FIG. 7 is a diagram illustrating a filtering characteristic in the casewhere an open stub is formed at a conductive line of a millimeter wavecommunication device according to an embodiment.

According to an embodiment, a rejection characteristic and a filteringbandwidth of the coupled first and second feed lines 144-1 and 145-1 ina state 710 where an open stub is formed at the first feed line 144-1 orthe second feed line 145-1 of the communication device 140 may beimproved compared with a state 720 before an open stub is formed.

FIGS. 8A and 8B are diagrams illustrating a first feed line and a secondfeed line of a millimeter wave communication device coupled throughsides formed with a specified width according to an embodiment.

Referring to FIGS. 8A and 8B, a first feed line 844-1 and a second feedline 845-1 may be coupled to each other.

According to an embodiment, the first feed line 844-1 may beelectrically connected to a communication IC 842. The second feed line845-1 may be electrically connected to a first antenna element 846-1.According to an embodiment, the first feed line 844-1 and the secondfeed line 845-1 may be positioned at an antenna PCB 841.

According to an embodiment, a first portion 844-1 a of the first feedline 844-1 may be positioned in a first layer. The first portion 844-1 aof the first feed line 844-1 may be formed in the first layer with afirst width. According to an embodiment, a second portion 845-1 a of thesecond feed line 845-1 may be positioned in a second layer, and adistance from the second layer to the first antenna element 846-1 may besmaller than a distance from the first layer to the first antennaelement 846-1. The second portion 845-1 a of the second feed line 845-1may be formed in the second layer with a second width. The second widthmay be, for example, identical to the first width. According to anembodiment, the first portion 844-1 a of the first feed line 844-1 andthe second portion 845-1 a of the second feed line 845-1 may bepositioned parallel to each other. According to an embodiment, a sideformed with the first width of the first portion 844-1 a of the firstfeed line 844-1 may be positioned to face a side formed with the secondwidth of the second portion 845-1 a of the second feed line 845-1. Assuch, the first portion 844-1 a of the first feed line 844-1 and thesecond portion 845-1 a of the second feed line 845-1 may be coupledthrough the sides thus formed.

According to an embodiment, compared with a line shape, the side formedwith the first width of the first feed line 844-1 and the side formedwith the second width of the second feed line 845-1 may correspond to astructure which may make placement in a specified layer easy, may reducethe fraction defective on a process, and may make it possible to use avertical space of an antenna PCB efficiently.

FIGS. 9A and 9B are diagrams illustrating an example where a portion ofa first feed line and a second feed line of a millimeter wavecommunication device are positioned in the same layer according to anembodiment.

Referring to FIGS. 9A and 9B, a first feed line 944-1 and a second feedline 945-1 may be coupled to each other.

According to an embodiment, the first feed line 944-1 may beelectrically connected to a communication IC 942. The second feed line945-1 may be electrically connected to a first antenna element 946-1.

According to an embodiment, a first portion 944-1 a of the first feedline 944-1 may be positioned in a first layer. According to anembodiment, a second portion 945-1 a of the second feed line 945-1 mayalso be positioned in the first layer. For example, the second portion945-1 a of the second feed line 945-1 may be positioned in the samelayer (e.g., the first layer) as the first portion 944-1 a of the firstfeed line 944-1. According to an embodiment, when viewed from above anantenna PCB 941, the first portion 944-1 a of the first feed line 944-1and the second portion 945-1 a of the second feed line 945-1 may bespaced from each other by a specified interval (or distance) and may bepositioned parallel to each other.

According to an embodiment, the first portion 944-1 a of the first feedline 944-1 may be formed in the first layer with a first height (orthickness). For another example, the second portion 945-1 a of thesecond feed line 945-1 may be formed in the first layer with a secondheight (or thickness). The second height may be, for example, identicalto the first height. According to an embodiment, a side formed to havethe first height (or thickness) of the first portion 944-1 a of thefirst feed line 944-1 may be positioned to face a side formed to havethe second height (or thickness) of the second portion 945-1 a of thesecond feed line 945-1. As such, the first portion 944-1 a of the firstfeed line 944-1 and the second portion 945-1 a of the second feed line945-1 may be coupled through the sides thus formed.

FIG. 10 is a sectional view illustrating how to adjust a couplinglocation of a millimeter wave communication device according to anembodiment.

Referring to FIG. 10, in a communication device 1040, a layer in which asecond portion 1045 a of a second feed line 1045 is positioned may bechanged.

According to an embodiment, the first feed line 144 may be electricallyconnected with the communication IC 142 and may be extended to penetratethe first layer M0 to the fourth layer M3, and the first portion 144 aof the first feed line 144 may be positioned in the fifth layer M4 witha first length. According to an embodiment, the second portion 1045 a ofthe second feed line 1045 may be positioned in the sixth layer M5 (orone of the sixth layer M5 to the eleventh layer M10), which is an upperlayer of the fifth layer M4, with a second length so as to be coupledwith the first portion 144 a of the first feed line 144. The secondlength may be, for example, identical to the first length. According toan embodiment, a frequency band to be filtered may be changed by adistance between the first portion 144 a of the first feed line 144 andthe second portion 1045 a of the second feed line 1045.

According to an embodiment, the communication device 1040 may change afrequency band targeted for transmission and/or reception by changing aninterval between the first portion 144 a of the first feed line 144 andthe second portion 1045 a of the second feed line 1045.

FIG. 11 is a graph illustrating a filtering characteristic uponadjusting a distance between a first feed line and a second feed line ofa millimeter wave communication device according to an embodiment.

Referring to FIG. 11, in the case where a layer in which the secondportion 1045 a of the second feed line 1045 is changed, a filteringbandwidth and a rejection characteristic of an operating frequency (or afrequency to be filtered) 1110 of the communication device 140 may bechanged (1110 a).

FIG. 12 is a diagram illustrating components of a millimeter wavecommunication device for respective functions, according to anembodiment.

Referring to FIG. 12, a communication device 1200 may include anamplifier 1210, a first feed line 1220, and a second feed line 1230.

According to an embodiment, the amplifier 1210 may amplify a transmitsignal by a specified magnitude. For example, the amplifier 1210 may beincluded in the communication IC 142 of the communication device 140 ofFIG. 2.

According to an embodiment, the first feed line 1220 may be connected toan output of the amplifier 1210. For example, the first feed line 1220may correspond to the first feed line 144 connected to the communicationIC 142 of FIG. 2. According to an embodiment, the second feed line 1230may be connected to an antenna element. For example, the second feedline 1230 may correspond to the second feed line 145 connected to theantenna element 146 of FIG. 2.

According to an embodiment, a first portion 1220 a of the first feedline 1220 and a second portion 1230 a of the second feed line 1230 maybe coupled to each other. The first portion 1220 a and the secondportion 1230 a thus coupled may filter a signal in a specified frequencyband. For example, the first portion 1220 a of the first feed line 1220may correspond to the first portion 144 a of the first feed line 144 ofFIG. 2, and the second portion 1230 a of the second feed line 1230 maycorrespond to the second portion 145 a of the second feed line 145 ofFIG. 2.

According to an embodiment, the first portion 1220 a and the secondportion 1230 a thus coupled may filter a direct current componentincluded in a transmit signal amplified by the amplifier 1210. Accordingto an embodiment, the first portion 1220 a of the first feed line 1220may return a portion of a signal transmitted to an antenna as afeedback. For example, the returned or feedback portion of the signalmay be used to determine whether a transmit signal is normally output.As such, the communication device 1200 (e.g., the communication device140) may not include a filter for removing a direct current component ofa transmit signal and a coupler for feeding back a portion of thetransmit signal.

FIG. 13 is a diagram illustrating an example where a variable capacitoris installed at a millimeter wave communication device according to anembodiment.

Referring to FIG. 13, a communication device 1300 may include anamplifier 1310, a first feed line 1320, a second feed line 1330, and atleast one variable capacitor 1340. For example, the communication device1300 may be similar to the communication device 1200 of FIG. 12.

According to an embodiment, the amplifier 1310, the first feed line1320, or the second feed line 1330 may be similar to the amplifier 1210,the first feed line 1220, or the second feed line 1230. According to anembodiment, a first portion 1320 a of the first feed line 1320 and asecond portion 1330 a of the second feed line 1330 may be coupled. Thefirst portion 1320 a and the second portion 1330 a thus coupled mayfilter a signal in a specified frequency band.

According to an embodiment, the variable capacitor 1340 may be connectedbetween the first portion 1320 a of the first feed line 1320 and aground. For another example, the variable capacitor 1340 may beconnected between the second portion 1330 a of the second feed line 1330and the ground. According to an embodiment, the communication device1300 may change a frequency band of a transmit signal or a receivesignal by adjusting a capacitance of the variable capacitor 1340. Thevariable capacitor 1340 may be, for example, a varactor.

FIG. 14 is a graph illustrating a filtering characteristic of amillimeter wave communication device where a variable capacitor isinstalled, according to an embodiment.

Referring to FIG. 14, in the case where the variable capacitor 1340 isconnected to the communication device 1300, an operating frequency (or afiltering frequency) 1410 of the communication device 1300 may vary witha capacitance of the variable capacitor 1340 (refer to 1410 a). As such,even though an operating frequency is changed due to a process variationand a process error, the operating frequency may be corrected byadjusting the capacitance of the variable capacitor 1340 installed atthe communication device 1300.

An electronic device according to various embodiments of the presentdisclosure may include a housing that includes a first plate and asecond plate facing a direction opposite the first plate, a conductiveplate disposed in a first plane between the first plate and the secondplate, and parallel to the second plate, a wireless communicationcircuit disposed within the housing and configured to transmit and/orreceive a signal having a frequency ranging from 20 GHz to 100 GHz, afirst electrical path having a first end electrically connected with thewireless communication circuit and a second end floated, the firstelectrical path including a first portion between the first end and thesecond end, a second electrical path having a third end electricallyconnected with the conductive plate and a fourth end floated, the secondelectrical path including a second portion between the third end and thefourth end. The first portion and the second portion may extend inparallel with each other and may provide electrical coupling between thefirst portion and the second portion.

The wireless communication circuit of the electronic device according toan embodiment of the present disclosure may be disposed in a secondplane parallel to the second plate and may be disposed between the firstplane and the first plate.

The electronic device according to an embodiment of the presentdisclosure may further include an antenna printed circuit board (PCB)including a first surface facing the first plate, a second surfacefacing the second plate, and a plurality of layers between the firstsurface and the second surface, wherein the wireless communicationcircuit may be mounted on the first surface.

The plurality of layers of the electronic device according to anembodiment of the present disclosure may include a first layer, a secondlayer between the first layer and the first surface, and a third layerbetween the first layer and the second surface, the first portion may bedisposed between the first layer and the second layer, and the secondportion may be disposed between the first layer and the third layer.

The conductive plate of the electronic device according to an embodimentof the present disclosure may be inserted between the third layer andthe second surface.

The electronic device according to an embodiment of the presentdisclosure may further include a first conductive via formed topenetrate a part of the plurality of layers, which is between the firstlayer and the first surface, and the first conductive via mayelectrically connects the wireless communication circuit and the firstportion.

The electronic device according to an embodiment of the presentdisclosure may further include a second conductive via formed topenetrate another part of the plurality of layers, which is between thefirst layer and the second surface, and the second conductive via mayelectrically connect the conductive plate and the second portion.

A millimeter wave communication device according to an embodiment of thepresent disclosure may include an antenna printed circuit board (PCB)including a plurality of layers, an integrated circuit (IC) that ispositioned under the antenna PCB, a first feed line that is electricallyconnected with the IC and is extended to a first layer through one ormore of the plurality of layers of the antenna PCB, a first portion ofthe first feed line being positioned in the first layer with a firstlength, a second feed line that is physically spaced from the firstportion of the first feed line and is positioned in a second layer ofthe antenna PCB, which is an upper layer of the first layer, so as to beelectrically coupled with the first portion of the first feed line, anda first antenna element that is electrically connected with the secondfeed line in a third layer of the antenna PCB, which is an upper layerof the second layer. The IC may transmit and/or receive a millimeterwave (mm-wave) signal using the first feed line, the second feed line,and the first antenna element.

The third layer of the millimeter wave communication device according toan embodiment of the present disclosure may be an uppermost layer of theantenna PCB.

The millimeter wave communication device according to an embodiment ofthe present disclosure may further include a parasitic antenna elementin an uppermost layer above the third layer.

The parasitic antenna element of the millimeter wave communicationdevice according to an embodiment of the present disclosure may bepositioned at the same location as the first antenna element when viewedfrom above the antenna PCB.

The millimeter wave communication device according to an embodiment ofthe present disclosure may further include a third feed line that iselectrically connected with the IC and is extended to the first layer, athird portion of the third feed line being positioned in the firstlayer, a fourth feed line that is positioned to be coupled with thethird portion, which is positioned in the first layer, of the third feedline in the second layer, and a second antenna element that iselectrically connected with the fourth feed line in the third layer.

In the case where the fourth feed line of the millimeter wavecommunication device according to an embodiment of the presentdisclosure is not electrically connected with the second antennaelement, the fourth feed line may be opened or may be connected to aground area.

In the case where the fourth feed line of the millimeter wavecommunication device according to an embodiment of the presentdisclosure is not electrically connected with the second antennaelement, the fourth feed line may be electrically connected with avariable capacitor.

The variable capacitor of the millimeter wave communication deviceaccording to an embodiment of the present disclosure may be a varactor.

The second feed line of the millimeter wave communication deviceaccording to an embodiment of the present disclosure may be electricallyconnected with the first antenna element and may be extended to thesecond layer through one or more of the plurality of layers of theantenna PCB, and a second portion of the second feed line may bepositioned in the second layer with a second length.

The second length of the millimeter wave communication device accordingto an embodiment of the present disclosure may be identical to the firstlength.

The millimeter wave communication device according to an embodiment ofthe present disclosure may further include a stub that is extended andformed from opposite ends of the second portion, which is positioned inthe second layer, of the second feed line.

The first portion, which is positioned in the first layer, of the firstfeed line of the millimeter wave communication device according to anembodiment of the present disclosure may be formed in the first layerwith a first width, and the second portion, which is positioned in thesecond layer, of the second feed line may be formed in the second layerwith a second width.

The first width of the millimeter wave communication device according toan embodiment of the present disclosure may be identical to the secondwidth.

The millimeter wave communication device according to an embodiment ofthe present disclosure may further include a plurality of grounds formedin a plurality of layers of the antenna PCB, and the plurality ofgrounds formed in the plurality of layers may be electrically connectedto a via.

A millimeter wave communication device according to various embodimentsof the present disclosure may include an antenna printed circuit board(PCB) including a plurality of layers, an integrated circuit (IC)positioned under the antenna PCB, and a first feed line electricallyconnected with the IC and extending to a first layer through one or moreof the plurality of layers of the antenna PCB, a first portion of thefirst feed line being disposed in the first layer and having a firstlength, a second feed line disposed to be coupled with the first portiondisposed in the first layer, of the first feed line in the first layer,and an antenna element electrically connected with the second feed linein a second layer of the antenna PCB, the second layer being an upperlayer of the first layer. The IC may transmit and/or receive amillimeter wave (mm-wave) signal using the first feed line, the secondfeed line, and the antenna element.

The millimeter wave communication device according to an embodiment ofthe present disclosure may further include a parasitic antenna elementin an uppermost layer above the second layer.

The first portion of the first feed line of the millimeter wavecommunication device, which is positioned in the first layer, accordingto an embodiment of the present disclosure is disposed to be spaced froma second portion of the second feed line, which is disposed in the firstlayer, by a specified interval.

The first portion of the first feed line of the millimeter wavecommunication device, which is disposed in the first layer, according toan embodiment of the present disclosure may be formed in the first layerhaving a first height, and the second portion of the second feed line,which is positioned in the first layer, may be formed in the first layerhaving a second height.

The first height of the millimeter wave communication device accordingto an embodiment of the present disclosure may be identical to thesecond height.

FIG. 15 is a block diagram illustrating an electronic device 1501 in anetwork environment 1500 according to various embodiments. Referring toFIG. 15, the electronic device 1501 in the network environment 1500 maycommunicate with an electronic device 1502 via a first network 1598(e.g., a short-range wireless communication network), or an electronicdevice 1504 or a server 1508 via a second network 1599 (e.g., along-range wireless communication network). According to an embodiment,the electronic device 1501 may communicate with the electronic device1504 via the server 1508. According to an embodiment, the electronicdevice 1501 may include a processor 1520, memory 1530, an input device1550, a sound output device 1555, a display device 1560, an audio module1570, a sensor module 1576, an interface 1577, a haptic module 1579, acamera module 1580, a power management module 1588, a battery 1589, acommunication module 1590, a subscriber identification module (SIM)1596, or an antenna module 1597. In some embodiments, at least one(e.g., the display device 1560 or the camera module 1580) of thecomponents may be omitted from the electronic device 1501, or one ormore other components may be added in the electronic device 1501. Insome embodiments, some of the components may be implemented as singleintegrated circuitry. For example, the sensor module 1576 (e.g., afingerprint sensor, an iris sensor, or an illuminance sensor) may beimplemented as embedded in the display device 1560 (e.g., a display).

The processor 1520 may execute, for example, software (e.g., a program1540) to control at least one other component (e.g., a hardware orsoftware component) of the electronic device 1501 coupled with theprocessor 1520, and may perform various data processing or computation.According to one embodiment, as at least part of the data processing orcomputation, the processor 1520 may load a command or data received fromanother component (e.g., the sensor module 1576 or the communicationmodule 1590) in volatile memory 1532, process the command or the datastored in the volatile memory 1532, and store resulting data innon-volatile memory 1534. According to an embodiment, the processor 1520may include a main processor 1521 (e.g., a central processing unit (CPU)or an application processor (AP)), and an auxiliary processor 1523(e.g., a graphics processing unit (GPU), an image signal processor(ISP), a sensor hub processor, or a communication processor (CP)) thatis operable independently from, or in conjunction with, the mainprocessor 1521. Additionally or alternatively, the auxiliary processor1523 may be adapted to consume less power than the main processor 1521,or to be specific to a specified function. The auxiliary processor 1523may be implemented as separate from, or as part of the main processor1521.

The auxiliary processor 1523 may control at least some of functions orstates related to at least one component (e.g., the display device 1560,the sensor module 1576, or the communication module 1590) among thecomponents of the electronic device 1501, instead of the main processor1521 while the main processor 1521 is in an inactive (e.g., sleep)state, or together with the main processor 1521 while the main processor1521 is in an active state (e.g., executing an application). Accordingto an embodiment, the auxiliary processor 1523 (e.g., an image signalprocessor or a communication processor) may be implemented as part ofanother component (e.g., the camera module 1580 or the communicationmodule 1590) functionally related to the auxiliary processor 1523.

The memory 1530 may store various data used by at least one component(e.g., the processor 1520 or the sensor module 1576) of the electronicdevice 1501. The various data may include, for example, software (e.g.,the program 1540) and input data or output data for a command relatedthereto. The memory 1530 may include the volatile memory 1532 or thenon-volatile memory 1534.

The program 1540 may be stored in the memory 1530 as software, and mayinclude, for example, an operating system (OS) 1542, middleware 1544, oran application 1546.

The input device 1550 may receive a command or data to be used by othercomponent (e.g., the processor 1520) of the electronic device 1501, fromthe outside (e.g., a user) of the electronic device 1501. The inputdevice 1550 may include, for example, a microphone, a mouse, a keyboard,or a digital pen (e.g., a stylus pen).

The sound output device 1555 may output sound signals to the outside ofthe electronic device 1501. The sound output device 1555 may include,for example, a speaker or a receiver. The speaker may be used forgeneral purposes, such as playing multimedia or playing record, and thereceiver may be used for an incoming calls. According to an embodiment,the receiver may be implemented as separate from, or as part of thespeaker.

The display device 1560 may visually provide information to the outside(e.g., a user) of the electronic device 1501. The display device 1560may include, for example, a display, a hologram device, or a projectorand control circuitry to control a corresponding one of the display,hologram device, and projector. According to an embodiment, the displaydevice 1560 may include touch circuitry adapted to detect a touch, orsensor circuitry (e.g., a pressure sensor) adapted to measure theintensity of force incurred by the touch.

The audio module 1570 may convert a sound into an electrical signal andvice versa. According to an embodiment, the audio module 1570 may obtainthe sound via the input device 1550, or output the sound via the soundoutput device 1555 or a headphone of an external electronic device(e.g., an electronic device 1502) directly (e.g., wiredly) or wirelesslycoupled with the electronic device 1501.

The sensor module 1576 may detect an operational state (e.g., power ortemperature) of the electronic device 1501 or an environmental state(e.g., a state of a user) external to the electronic device 1501, andthen generate an electrical signal or data value corresponding to thedetected state. According to an embodiment, the sensor module 1576 mayinclude, for example, a gesture sensor, a gyro sensor, an atmosphericpressure sensor, a magnetic sensor, an acceleration sensor, a gripsensor, a proximity sensor, a color sensor, an infrared (IR) sensor, abiometric sensor, a temperature sensor, a humidity sensor, or anilluminance sensor.

The interface 1577 may support one or more specified protocols to beused for the electronic device 1501 to be coupled with the externalelectronic device (e.g., the electronic device 1502) directly (e.g.,wiredly) or wirelessly. According to an embodiment, the interface 1577may include, for example, a high definition multimedia interface (HDMI),a universal serial bus (USB) interface, a secure digital (SD) cardinterface, or an audio interface.

A connecting terminal 1578 may include a connector via which theelectronic device 1501 may be physically connected with the externalelectronic device (e.g., the electronic device 1502). According to anembodiment, the connecting terminal 1578 may include, for example, aHDMI connector, a USB connector, a SD card connector, or an audioconnector (e.g., a headphone connector).

The haptic module 1579 may convert an electrical signal into amechanical stimulus (e.g., a vibration or a movement) or electricalstimulus which may be recognized by a user via his tactile sensation orkinesthetic sensation. According to an embodiment, the haptic module1579 may include, for example, a motor, a piezoelectric element, or anelectric stimulator.

The camera module 1580 may capture a still image or moving images.According to an embodiment, the camera module 1580 may include one ormore lenses, image sensors, image signal processors, or flashes.

The power management module 1588 may manage power supplied to theelectronic device 1501. According to one embodiment, the powermanagement module 1588 may be implemented as at least part of, forexample, a power management integrated circuit (PMIC).

The battery 1589 may supply power to at least one component of theelectronic device 1501. According to an embodiment, the battery 1589 mayinclude, for example, a primary cell which is not rechargeable, asecondary cell which is rechargeable, or a fuel cell.

The communication module 1590 may support establishing a direct (e.g.,wired) communication channel or a wireless communication channel betweenthe electronic device 1501 and the external electronic device (e.g., theelectronic device 1502, the electronic device 1504, or the server 1508)and performing communication via the established communication channel.The communication module 1590 may include one or more communicationprocessors that are operable independently from the processor 1520(e.g., the application processor (AP)) and supports a direct (e.g.,wired) communication or a wireless communication. According to anembodiment, the communication module 1590 may include a wirelesscommunication module 1592 (e.g., a cellular communication module, ashort-range wireless communication module, or a global navigationsatellite system (GNSS) communication module) or a wired communicationmodule 1594 (e.g., a local area network (LAN) communication module or apower line communication (PLC) module). A corresponding one of thesecommunication modules may communicate with the external electronicdevice via the first network 1598 (e.g., a short-range communicationnetwork, such as Bluetooth™, wireless-fidelity (Wi-Fi) direct, orinfrared data association (IrDA)) or the second network 1599 (e.g., along-range communication network, such as a cellular network, theInternet, or a computer network (e.g., LAN or wide area network (WAN)).These various types of communication modules may be implemented as asingle component (e.g., a single chip), or may be implemented as multicomponents (e.g., multi chips) separate from each other. The wirelesscommunication module 1592 may identify and authenticate the electronicdevice 1501 in a communication network, such as the first network 1598or the second network 1599, using subscriber information (e.g.,international mobile subscriber identity (IMSI)) stored in thesubscriber identification module 1596.

The antenna module 1597 may transmit or receive a signal or power to orfrom the outside (e.g., the external electronic device) of theelectronic device 1501. According to an embodiment, the antenna module1597 may include an antenna including a radiating element composed of aconductive material or a conductive pattern formed in or on a substrate(e.g., PCB). According to an embodiment, the antenna module 1597 mayinclude a plurality of antennas. In such a case, at least one antennaappropriate for a communication scheme used in the communicationnetwork, such as the first network 1598 or the second network 1599, maybe selected, for example, by the communication module 1590 (e.g., thewireless communication module 1592) from the plurality of antennas. Thesignal or the power may then be transmitted or received between thecommunication module 1590 and the external electronic device via theselected at least one antenna. According to an embodiment, anothercomponent (e.g., a radio frequency integrated circuit (RFIC)) other thanthe radiating element may be additionally formed as part of the antennamodule 1597.

At least some of the above-described components may be coupled mutuallyand communicate signals (e.g., commands or data) therebetween via aninter-peripheral communication scheme (e.g., a bus, general purposeinput and output (GPIO), serial peripheral interface (SPI), or mobileindustry processor interface (MIPI)).

According to an embodiment, commands or data may be transmitted orreceived between the electronic device 1501 and the external electronicdevice 1504 via the server 1508 coupled with the second network 1599.Each of the electronic devices 1502 and 1504 may be a device of a sametype as, or a different type, from the electronic device 1501. Accordingto an embodiment, all or some of operations to be executed at theelectronic device 1501 may be executed at one or more of the externalelectronic devices 1502, 1504, or 1508. For example, if the electronicdevice 1501 should perform a function or a service automatically, or inresponse to a request from a user or another device, the electronicdevice 1501, instead of, or in addition to, executing the function orthe service, may request the one or more external electronic devices toperform at least part of the function or the service. The one or moreexternal electronic devices receiving the request may perform the atleast part of the function or the service requested, or an additionalfunction or an additional service related to the request, and transferan outcome of the performing to the electronic device 1501. Theelectronic device 1501 may provide the outcome, with or without furtherprocessing of the outcome, as at least part of a reply to the request.To that end, a cloud computing, distributed computing, or client-servercomputing technology may be used, for example.

The electronic device according to various embodiments may be one ofvarious types of electronic devices. The electronic devices may include,for example, a portable communication device (e.g., a smartphone), acomputer device, a portable multimedia device, a portable medicaldevice, a camera, a wearable device, or a home appliance. According toan embodiment of the disclosure, the electronic devices are not limitedto those described above.

It should be appreciated that various embodiments of the presentdisclosure and the terms used therein are not intended to limit thetechnological features set forth herein to particular embodiments andinclude various changes, equivalents, or replacements for acorresponding embodiment. With regard to the description of thedrawings, similar reference numerals may be used to refer to similar orrelated elements. It is to be understood that a singular form of a nouncorresponding to an item may include one or more of the things, unlessthe relevant context clearly indicates otherwise. As used herein, eachof such phrases as “A or B,” “at least one of A and B,” “at least one ofA or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least oneof A, B, or C,” may include any one of, or all possible combinations ofthe items enumerated together in a corresponding one of the phrases. Asused herein, such terms as “1st” and “2nd,” or “first” and “second” maybe used to simply distinguish a corresponding component from another,and does not limit the components in other aspect (e.g., importance ororder). It is to be understood that if an element (e.g., a firstelement) is referred to, with or without the term “operatively” or“communicatively”, as “coupled with,” “coupled to,” “connected with,” or“connected to” another element (e.g., a second element), it means thatthe element may be coupled with the other element directly (e.g.,wiredly), wirelessly, or via a third element.

As used herein, the term “module” may include a unit implemented inhardware, software, or firmware, and may interchangeably be used withother terms, for example, “logic,” “logic block,” “part,” or“circuitry”. A module may be a single integral component, or a minimumunit or part thereof, adapted to perform one or more functions. Forexample, according to an embodiment, the module may be implemented in aform of an application-specific integrated circuit (ASIC).

Various embodiments as set forth herein may be implemented as software(e.g., the program 1540) including one or more instructions that arestored in a storage medium (e.g., internal memory 1536 or externalmemory 1538) that is readable by a machine (e.g., the electronic device1501). For example, a processor (e.g., the processor 1520) of themachine (e.g., the electronic device 1501) may invoke at least one ofthe one or more instructions stored in the storage medium, and executeit, with or without using one or more other components under the controlof the processor. This allows the machine to be operated to perform atleast one function according to the at least one instruction invoked.The one or more instructions may include a code generated by a complieror a code executable by an interpreter. The machine-readable storagemedium may be provided in the form of a non-transitory storage medium.Wherein, the term “non-transitory” simply means that the storage mediumis a tangible device, and does not include a signal (e.g., anelectromagnetic wave), but this term does not differentiate betweenwhere data is semi-permanently stored in the storage medium and wherethe data is temporarily stored in the storage medium.

According to an embodiment, a method according to various embodiments ofthe disclosure may be included and provided in a computer programproduct. The computer program product may be traded as a product betweena seller and a buyer. The computer program product may be distributed inthe form of a machine-readable storage medium (e.g., compact disc readonly memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded)online via an application store (e.g., PlayStore™), or between two userdevices (e.g., smart phones) directly. If distributed online, at leastpart of the computer program product may be temporarily generated or atleast temporarily stored in the machine-readable storage medium, such asmemory of the manufacturer's server, a server of the application store,or a relay server.

According to various embodiments, each component (e.g., a module or aprogram) of the above-described components may include a single entityor multiple entities. According to various embodiments, one or more ofthe above-described components may be omitted, or one or more othercomponents may be added. Alternatively or additionally, a plurality ofcomponents (e.g., modules or programs) may be integrated into a singlecomponent. In such a case, according to various embodiments, theintegrated component may still perform one or more functions of each ofthe plurality of components in the same or similar manner as they areperformed by a corresponding one of the plurality of components beforethe integration. According to various embodiments, operations performedby the module, the program, or another component may be carried outsequentially, in parallel, repeatedly, or heuristically, or one or moreof the operations may be executed in a different order or omitted, orone or more other operations may be added.

While the present disclosure has been illustrated and described withreference to various example embodiments thereof, it will be understoodby those skilled in the art that various changes in form and details maybe made therein without departing from the spirit and scope of thepresent disclosure as defined, for example, in the appended claims, andtheir equivalents.

1-20. (canceled)
 21. An electronic device comprising: a housingincluding a first plate and a second plate; a printed circuit board(PCB) including a plurality of layers and at least one antenna disposedbetween the first plate and the second plate; a conductive platedisposed in a first plane of the PCB between at least the first plateand the second plate; a wireless communication circuit disposed withinthe housing, and configured to transmit and/or receive a signal; a firstelectrical path having a first end electrically connected with thewireless communication circuit and a second end floated in the PCB,wherein the first electrical path includes a first portion between thefirst end and the second end; and a second electrical path having athird end electrically connected with the conductive plate and a fourthend floated in the PCB, wherein the second electrical path includes asecond portion between the third end and the fourth end, wherein thefirst portion of the first electrical path and the second portion of thesecond electrical path are spaced from each other by one or more layersof the plurality of layers of the PCB, at least partially extend inparallel with each other, and provide electrical coupling between atleast the first portion and the second portion, and wherein theelectronic device further comprises: a first ground layer disposed in alayer of the PCB between the first portion and the wirelesscommunication circuit; a second ground layer disposed in a layer of thePCB between the second portion and the conductive plate; and a pluralityof vias disposed on multiple sides of the first and second portions andelectronically connecting the first ground layer to the second groundlayer.
 22. The electronic device of claim 21, wherein the wirelesscommunication circuit is disposed in a second plane parallel to thesecond plate and between the first plane and the first plate.
 23. Theelectronic device of claim 21, wherein: the PCB includes a first surfacefacing the first plate, a second surface facing the second plate, andcomprising the plurality of layers are disposed between the firstsurface and the second surface, wherein the wireless communicationcircuit is mounted on the first surface.
 24. The electronic device ofclaim 23, wherein the plurality of layers includes a first layer, asecond layer disposed between the first layer and the first surface, anda third layer disposed between the first layer and the second surface,wherein the first portion is disposed between the first layer and thesecond layer, and wherein the second portion is disposed between thefirst layer and the third layer.
 25. The electronic device of claim 24,wherein the conductive plate is disposed between the third layer and thesecond surface.
 26. The electronic device of claim 25, furthercomprising: a first conductive via penetrating a part of the pluralityof layers between the first layer and the first surface, wherein thefirst conductive via electrically connects the wireless communicationcircuit and the first portion.
 27. The electronic device of claim 26,further comprising: a second conductive via penetrating another part ofthe plurality of layers between the first layer and the second surface,wherein the second conductive via electrically connects the conductiveplate and the second portion.
 28. A millimeter wave communication deviceof an electronic device, comprising: an antenna printed circuit board(PCB) including a plurality of layers; an integrated circuit (IC)positioned under at least the antenna PCB; a first feed lineelectrically connected with the IC and extending to a first layer of theplurality of layers through one or more of the plurality of layers ofthe antenna PCB, wherein a first portion of the first feed line isdisposed in the first layer; a second feed line including a secondportion spaced from the first portion of the first feed line anddisposed in a second layer of the plurality of layers of the antenna PCBso as to be electrically coupled with the first portion of the firstfeed line, the second layer being an upper layer of the first layer; anda first antenna element electrically connected with the second feed linein a third layer of the antenna PCB, the third layer being an upperlayer of the second layer, wherein the IC is configured to transmitand/or receive a signal by way of the first feed line, the second feedline, and the first antenna element, and wherein the millimeter wavecommunication device further comprises: a first ground layer disposed ina layer of the PCB between the first portion and the IC; a second groundlayer disposed in a layer of the PCB between the second portion and thefirst antenna element; and a plurality of vias disposed on multiplesides of the first and second portions and electronically connecting thefirst ground layer to the second ground layer.
 29. The millimeter wavecommunication device of claim 28, further comprising: a parasiticantenna element disposed in an uppermost layer above the third layer.30. The millimeter wave communication device of claim 28, furthercomprising: a third feed line electrically connected with the IC andextending to the first layer, wherein a third portion of the third feedline is disposed in the first layer; a fourth feed line disposed to becoupled with the third portion, which is positioned in the first layer,of the third feed line in the second layer; and a second antenna elementelectrically connected with the fourth feed line in the third layer. 31.The millimeter wave communication device of claim 28, furthercomprising: a third feed line electrically connected with the IC andextending to the first layer, wherein a third portion of the third feedline is disposed in the first layer; and a fourth feed line disposed tobe coupled with the third portion, which is positioned in the firstlayer, of the third feed line in the second layer, wherein the fourthfeed line is configured to be opened or to be connected to a groundarea.
 32. The millimeter wave communication device of claim 28, furthercomprising: a third feed line electrically connected with the IC andextending to the first layer, wherein a third portion of the third feedline is disposed in the first layer; and a fourth feed line disposed tobe coupled with the third portion, which is positioned in the firstlayer, of the third feed line in the second layer, wherein the fourthfeed line is configured to be electrically connected with a variablecapacitor.
 33. The millimeter wave communication device of claim 32,wherein the variable capacitor comprises a varactor.
 34. The millimeterwave communication device of claim 28, wherein the second feed line iselectrically connected with the first antenna element and extends to thesecond layer through one or more of the plurality of layers of theantenna PCB, and wherein the second portion of the second feed line isdisposed in the second layer.
 35. The millimeter wave communicationdevice of claim 28, wherein the first portion and the second portion areconfigured to filter a portion of a signal which is transmitted and/orreceived through the first antenna element, and wherein a frequency bandof the signal to be filtered is determined according to a length of thefirst portion and the second portion thus coupled.
 36. The millimeterwave communication device of claim 34, further comprising: a stubextending from and formed at opposite ends of the second portion, whichis positioned in the second layer, of the second feed line.
 37. Themillimeter wave communication device of claim 28, wherein the firstportion, which is positioned in the first layer, of the first feed lineis formed in the first layer and having a first width, and wherein thesecond portion, which is positioned in the second layer, of the secondfeed line is formed in the second layer and has a second width.
 38. Themillimeter wave communication device of claim 37, wherein the firstwidth and the second width are identical.
 39. A millimeter wavecommunication device of an electronic device, comprising: an antennaprinted circuit board (PCB) including a plurality of layers; anintegrated circuit (IC) disposed under the antenna PCB; a first feedline electrically connected with the IC and extending to a first layerof the plurality of layers through one or more of the plurality oflayers of the antenna PCB, wherein a first portion of the first feedline is disposed in the first layer; a second feed line including asecond portion disposed to be coupled with the first portion, positionedin the first layer, of the first feed line in the first layer; anantenna element electrically connected with the second feed line in asecond layer of the antenna PCB, the second layer being an upper layerof the first layer, wherein the IC is configured to transmit and/orreceive a signal by way of the first feed line, the second feed line,and the antenna element, wherein an open stub is formed proximate to atleast one end of the first feed line and the second feed line, andwherein the millimeter wave communication device further comprises: afirst ground layer disposed in a layer of the antenna PCB between thefirst portion and the IC; a second ground layer disposed in a layer ofthe antenna PCB between the second layer of the antenna PCB and theantenna element; and a plurality of vias disposed on multiple sides ofthe first portion and electronically connecting the first ground layerto the second ground layer.
 40. The millimeter wave communication deviceof claim 39, wherein the first portion, which is disposed in the firstlayer, of the first feed line is disposed to be spaced from the secondportion, which is positioned in the first layer, of the second feed lineby a specified interval.